socalfunplaces Chapter 109 Intel's Series of Moves
Chapter 109 Intel's Series of Moves
At 9:00 AM, Intel's third-party testing lab, SI, released a technical briefing. Titled "Preliminary Analysis of Potential Issues with New High-Speed Interface Technology," the briefing appeared neutral, but its content was carefully crafted.
Key points of the briefing:
1. Electromagnetic interference test: When UHSB is transmitting at full speed of 5Gbps, the electromagnetic radiation value is 15% higher than the FCC Class B standard (test environment: unshielded inexpensive cable).
2. Heat dissipation issue: After 30 minutes of continuous large file transfer, the interface temperature rose to 72°C (test conditions: enclosed chassis, no active cooling).
3. Compatibility risk: There is a power supply timing conflict with some older power supplies (test subject: low-end power supplies from five years ago).
SI's CEO wrote a seemingly objective comment at the end of the briefing: "Any new technology requires thorough testing and iteration. Manufacturers are advised to carefully assess the risks of large-scale commercialization."
This briefing was sent to 300 media outlets and industry analysts via email list.
At 11 a.m., the market reaction began to take hold.
CNBC technology reporter first reported: "Third-party tests show that the UHSB has overheating and radiation exceeding standards. Experts are urging caution in dealing with the new standards."
The Wall Street Journal's technology section followed up: "Speed or stability? UHSB faces technical questions. Enterprise IT procurement departments say they will wait and see."
Three analysts with close ties to Intel released a report:
Goldman Sachs hardware analyst: "Investors are advised to exercise caution regarding UHSB-related concepts and wait at least six months for more test data."
Morgan Stanley technology analyst: "The adoption cycle for the new standard may take longer than expected."
An IDC industry analyst stated, "If the issue is true, the commercialization of UHSB could be delayed until 1998."
Michael Dell saw the briefing in his office. He called the VP of Technology directly: "What are our test results?"
"Our tests show that under normal chassis conditions and with standard cables, electromagnetic radiation meets the standards, and the temperature is below 55 degrees Celsius," the vice president replied.
"Then we'll release one of our test reports to the media," Dell said. "And, incidentally, to 'anonymously' reveal, our testing conditions are closer to real-world usage scenarios than SI's."
Eckhard Favor called an emergency meeting. "Intel has started to act," he told the team. "This is standard technical FUD. But we have to respond."
The VP of Marketing asked, "Should we publicly refute this?"
"No," Febreze shook his head. "We'll just say one thing: 'Compaq has always been proactive yet cautious about new technologies, and we will make decisions based on our own testing.' We won't offend Intel, nor will we abandon UHSB."
Lou Platt had his assistant gather all the reports. "Have the corporate clients responded?" he asked the sales manager.
"Several large clients have asked if there are really problems with UHSB. They are concerned about the stability of the data center."
Pratt nodded: "Inform the enterprise sales team that the standard response is: 'HP rigorously verifies all new technologies, and UHSB is currently still in the evaluation stage.'"
Jerry Sanders was furious: "This is a fucking Intel stunt! Our chip design is perfectly fine!" He ordered the technical department to immediately prepare a rebuttal to the data, but the public relations director warned: "If we publicly refute it, it's tantamount to going to war with Intel."
Sanders calmed down: "Then let's not release it for now. Let's wait for the league meeting to decide."
Ling Yun looked at the news summary on the computer screen, with Fiona standing beside him.
"Intel is moving very quickly," Ling Yun said.
"Should we respond?" Fiona asked.
"Yes, but not now," Ling Yun pondered. "First, get the alliance on a unified front. Schedule a video conference for tomorrow morning, with the four founding members plus AMD."
What materials do I need to prepare?
"Our complete test data, FCC certification documents, and SI test condition analysis—point out how unprofessional their test conditions are."
At 7 p.m., Lingyun received a private email from Dell:
"Ling, Intel has started putting pressure on us. This was expected. Dell will stick to our test results. I suggest the alliance unify its response strategy as soon as possible. Also, Compaq's attitude is somewhat ambiguous; keep a close eye on it. —Michael"
Lingyun replied: "Received. See you at the meeting tomorrow."
The next morning, as soon as Lingyun arrived at work, he received Fiona's report, which contained a summary of the latest actions taken by Intel.
1. Hardware Partner Program Upgrade
Intel announced an upgrade to the "Intel Preferred Partner Program," offering partners the following benefits:
USB device chip procurement discount (up to 15%)
Joint Marketing Fund (US$1 subsidy for each USB device sold)
Priority technical support
Condition: The partner shall not launch UHSB products within the next six months.
2. Pressure on motherboard manufacturers
Intel has notified major motherboard manufacturers such as ASUS, Gigabyte, and MSI that motherboards with a UHSB interface in their design will not receive Intel's "Design Ready" certification. Without this certification, many OEMs will not purchase their products.
3. Peripheral vendor lobbying
Microsoft joined in the pressure, informing Logitech, Microsoft Hardware, Canon, and HP Printers that if UHSB is prioritized, the priority of Windows Hardware Compatibility Testing (WHQL) will be reduced.
Market reaction:
Logitech announced: "To ensure user compatibility, Logitech's next-generation products will support both USB and UHSB." While seemingly neutral, "supporting both" implies that the product release will be delayed by at least three months.
In a media interview, ASUS CEO said, "Motherboard design needs to take into account both new and old standards. UHSB is a great technology, but market acceptance takes time," hinting at a possible delay in the release of motherboards with UHSB interfaces.
Analyst reports are starting to follow up:
"Ecosystem support is key to the success of the new standard. Currently, major peripheral manufacturers are cautious about UHSB, which may affect the initial adoption rate."
After reviewing the report Fiona had prepared, Ling Yun was very satisfied with his secretary. She was proactive and thoughtful. "Fiona did a good job. The content is detailed and well-organized. Show it to the others at the meeting later."